1Gb mobile DRAM
Hynix Semiconductor, Inc. announced it has developed the industry's smallest 1Gb mobile DRAM. Mobile DRAMs are widely used in wireless and handheld applications such as mobile phones, digital still and video cameras, PDAs, PMPs, and GPS Navigation systems. These products are now designed in smaller and smaller packages reducing the size of the battery. Hynix's Mobile DRAMs are designed to meet the memory requirements of feature-rich portable applications that demand high memory density, high throughput and very low power dissipation features in a small form factor package. The product is also the industry's first commercially available 1Gb mobile DRAM built on Hynix's 66 nm process technology.
Smallest 1Gb mobile DRAM
It operates at a maximum clock speed of 200MHz resulting in a throughput of up to 1.6 Gbytes of data per second with a 32-bit I/O - the fastest in the industry. The product consumes very low power, under worst case conditions, extending battery life in a wide range of portable electronic devices. The 1Gb Mobile DRAM is one product in Hynix's family of 'One Chip Solutions' that combine SDRAM/DDR DRAM interfaces, and x16/x32 organizations on a single chip, allowing Hynix the flexibility of offering wire bonded options to meet the specific needs of the customer.
1 Gb mobile DRAM - Availability
Hynix plans to begin mass production from the first quarter of 2008. The product will be available as 'NAND flash Multi-Chip Package (NAND MCP)', which combines DRAM and NAND flash in a single package, or 'package-on-package (POP)'stack. It will also be offered as 'KGD (Known Good Die)' for System in Package (SIP) applications.
Hynix Semiconductor Inc. (HSI) of Icheon, Korea, is the world's top tier memory semiconductor supplier offering Dynamic Random Access Memory chips ("DRAMs") and Flash memory chips to a wide range of established international customers. The Company's shares are traded on the Korea Stock Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange.